Porous LSCF/dense 3YSZ interface fracture toughness measured by single cantilever beam wedge test

Behavior of Concrete round Double Beam Fracture Toughness Test Specimens

Laboratory fracture toughness tests of concrete using wedge-loaded round double beam specimens with a length to diameter ratio of 2:1 show two distinctly different specimen behaviors. Either the crack remains in the plane of the notch, and a valid test result can be obtained, or there is lateral cracking around mid-length which invalidates the results. Results of a controlled study show that th...

Fracture toughness of dental composites determined using the short-rod fracture toughness test.

Plane strain fracture toughness (KIC) has been evaluated for a number of commercially-available dental composites. A modified Short-rod Fracture Toughness (SRFT) specimen design has been used, enabling small specimens to be tested conveniently. The effect on KIC of aging in water at 37 degrees C for seven days, one month, and six months has been determined for conventional, microfilled, and hyb...

The double cantilever beam test applied to mode I fracture characterization of cortical bone tissue.

The primary objective of this work was to analyse the adequacy of the Double Cantilever Beam (DCB) test in determining fracture toughness under pure mode I loading of cortical bone tissue. A new data reduction scheme based on specimen compliance and the crack equivalent concept was used to overcome the difficulties inherent in crack monitoring during its growth. It provides a complete resistanc...

Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

The semiconductor industry is gradually moving from well-established AlySiO technology to the new Cuylow-k interconnects, 2 which brings a challenge in terms of poor thermal andyor mechanical properties of low-K dielectric films. Extensive nanoindentation studies have been undertaken on organo-silicate glass (OSG) low-K films to explore their mechanical and fracture properties. A cube corner in...

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages